Smartphone DRAM and memory manufacturers are researching towards launching faster and more efficient chips to excel in the use of on-device AI applications and to offset the performance throttling issues encountered by the current technology. SK hynix, which has surpassed Samsung in the technological aspect of memory manufacturing, has said that it has begun supplying a newer form of mobile DRAM that adopts an industry-first ‘Molding Compound’ that is designed to tackle overheating in smartphones. The company claims the latest memory chips’ thermal conductivity has improved by 350 percent.

The new material used on SK hynix’s mobile DRAM is called ‘High-K Epoxy Molding Compound’

With the improvements highlighted by SK hynix on its latest mobile DRAM, the company says that the thermal resi

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