Nov 29 (Reuters) – Micron Technology will invest 1.5 trillion yen ($9.6 billion) to build a new plant in Hiroshima in western Japan to produce advanced high-bandwidth memory (HBM) chips, the Nikkei reported on Saturday, citing people familiar with the matter.

The U.S. chipmaker aims to start construction at an existing site in May next year and begin shipments around 2028, with Japan’s Ministry of Economy, Trade and Industry providing up to 500 billion yen for the project, the Nikkei said.

Reuters could not immediately verify the report.

To revive its aging semiconductor industry, Japan’s government is offering generous subsidies to lure investment from foreign chip makers such as Micron and Taiwan Semiconductor Manufacturing Co (TSMC). It is also funding the construction of a plant tha

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