Amkor Technology, a leading provider of semiconductor packaging and test services, today announced the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.

Upon completion of both phases, the campus will offer over 750,000 square feet of cleanroom space and as many as 3,000 high-quality jobs. Construction of the first manufacturing facility on the campus is expected to be completed in mid-2027, with production beginning in early 2028. The new greenfield facilities will serve as a cornerstone of America’s advanced packaging capabilities, supporting key customers including Apple and NVIDIA. Amkor’s expanded investment is supported by the Trump Administration’s CHIPS for America Program, the Advance

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