It appears that the advanced packaging services are starting to emerge as a 'massive prospect' for Intel Foundry, as they manage to receive attention from several US customers who have placed chip orders at TSMC Arizona.

TSMC Arizona Customers Are Looking Towards Intel For Advanced Packaging Services, Opening Up a New Prospect for the IFS

For those unaware, the US is pursuing an independent supply chain, which involves setting up all stages of manufacturing, including semiconductor R&D, volume manufacturing, and advanced packaging. The nation has been successful in producing processes onshore; however, it currently has few options for packaging. It would not be incorrect to say that, among all competitors in the US chip industry, Intel has the widest and most advanced packaging portfolio

See Full Page