TSMC’s push towards breaking the 2nm ceiling and jumping towards 1.4nm wafer production is scheduled to happen during the second half of 2028 , with the Taiwanese semiconductor titan reportedly forking an initial investment of $49 billion that will go towards the construction of four plants . In close pursuit is Japan’s Rapidus, which reportedly aims to begin work on a facility for manufacturing wafers on the exact same lithography in 2027. However, there are also plans to research and develop 1nm chips at the same site, but that will happen at a later time.

Rapidus’ plans have received the necessary stimulus from the government and local firms, who have heavily invested in the startup to achieve the goal of manufacturing 1.4nm wafers

A report from Nikkei Asia states that Hokkaido

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