Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures

LEUVEN, Belgium , Dec. 8, 2025 /PRNewswire/ --

Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach.

The study allows to identify and mitigate thermal bottlenecks in a promising next-gen compute system architecture for AI applications.

Peak GPU temperatures could be reduced from 140.7°C to 70.8°C under realistic AI training workloads .

"This is also the first time that we demonstrate the capabilities of imec's new cross-technology co-optimization (XTCO) program in developing more thermally robust advanced

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