Advanced packaging is becoming one of the biggest constraints for the AI industry, and according to a new report, NVIDIA has already secured a giant share of the CoWoS capacity.

NVIDIA Has Reserved More Than 50% of TSMC’s CoWoS Production, with Broadcom and AMD Following

We have covered specifics about advanced packaging quite a few times in the past week, but one of the more interesting information that has surfaced is that NVIDIA is projected to 'gobble up' more than half of TSMC's CoWoS capacity moving into 2026, which is likely to target the ongoing Blackwell Ultra rampup, as well as prepare for the next-generation Rubin architecture. A report by DigiTimes states that NVIDIA has booked 800,000 to 850,000 wafers for 2026, which represents a substantial allocation compared to what co

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